Four core technical parameters define the performance of the speakers: Sensitivity, Impedance, Frequency Range, and Speaker Dimensions.

According to the analysis of faulty headphones handled by the after-sales repair department of Inbertec, malfunctions caused by headphone wire detachment are mainly concentrated at the soldered connection points in the following areas:

1.MEMS Microphone (Silicon Microphone) Ever wondered how your headphones’ tiny microphone picks up your voice? That’s probably a MEMS microphone—short for Micro-Electro-Mechanical System. Think of it as a "miniature sound detector" built on a silicon chip. At its core are two ultra-thin parts: a vibrating diaphragm and a fixed backplate, with a tiny air gap between them. Together, they form a tiny capacitor (a device that stores electric charge). When sound waves hit the diaphragm, it wiggles gently with the sound pressure. This wiggling changes the size of the air gap, which in turn alters the capacitor’s ability to hold charge. The microphone’s built-in circuit catches this change and turns it into an electrical signal that your device can understand.